Mark 40

  • CHA Mark 40 with ergonomic door "height" option.

  • CHA Mark 40 interior chamber detail.

  • CHA Mark 40 console detail.

Combining the best features of CHA Industries' Mark 50 system with a broad array of options, the innovative Mark 40 represents a distinct breakthrough in vacuum deposition systems offering efficiency, flexibility and ease of maintenance. The Mark 40 accommodates a wide variety of deposition equipment, including versatile combinations of deposition sources and substrates fixturing to address virtually any application. SECS/GEM and CE compliant.

  • Dual Operation, Sputtering and Evaporation
  • Moving substrates
  • Exceptional Film Uniformity (Fixture Dependent)
  • Sputter Up
  • Process Stations
    • Round Cathodes, RF or DC (Up to 4 Stations)
    • Co-deposit
    • Bias, RF or DC
    • Substrate heating, 400°C, multi-element
    • Substrate heating, station
    • Electron beam
    • Thermal
    • Ion beam pre-clean/etch
    • Plasma texturing/etch

  • Power Supply Options
    • Electron beam, 6-10-15 kW
    • Sputtering, 1-3-5-15-30 KW
    • Heater, 6-10-16 kW
    • Thermal deposition, 1-5-10 kW

  • Process Chamber
    • Insitu spectrophotometer
    • Drop well source
    • Easy access to front and rear door
    • Variable source-to-substrate distance

  • Utilities
    • Water Supply, 10 GPM
    • Air supply, 85-125 PSIG

  • Deposition Fixturing
    • Adjustable angle planet, standard
    • Vertical drum with pallets, standard
    • Rotating disk, optional
    • Rotating dome, optional
    • Flat planetary, 3 or 4, optional
    • Shutter(s), flag

  • Pumping Stack
    • Dry or oil sealed roughing
    • Regeneration options
    • Famous right angle pumping/plumbing
    • Exceptional pumping performance
    • High vacuum valve, vertical seal, 16"
    • Foreline and roughing valves, vertical seal, 3"
    • Large refrigeration vapor pumping options
    • Mechanical pump, minimum CFM
    • Molecular sieve trap
    • Cold trap LN2, 25L pump trap, optional water pump
    • LN2 level control
    • Ionization gauge control
    • Gas controls

  • Pumping Options
    • Cryo
    • Turbo
    • Diffusion

  • Ultimate Vacuum
    • System 10 -9 Torr
    • Chamber 10 -8 Torr

  • Cryo Coil
  • 1,000 L/Sec. pumping speed for water vapor and other condensable gases in the process chamber

  • Footprint
    • 79.5" W x 64"D x 78.5"H (with ISO source add 21"H)