SEC-1000/SE-1000

  • CHA SEC-1000/SE-1000.

  • SEC-1000 system is equipped with a 25.5" diameter,
    water-cooled bell jar and planetary (shown) or Lift-Off Fixturing.

High Vacuum Deposition Systems

The largest of the SE/SEC-Series, the SE-1000, is typically equipped with a 25.5" diameter, water-cooled bell jar, a 26" diameter stainless steel baseplate, and Planetary Fixturing holding up to thirty six 4" wafers. One Button Automation and Lift-Off Fixturing are among the most popular options added to the system.

Ultimate vacuum: 10-8 torr range

  • Ultimate vacuum: 10-8 torr range
  • Cryogenic pump: 10"
  • Mechanical pump: 23-57 CFM, dual stage
  • Cold trap: 3.7 liter capacity, 250 sq. inches of surface area, 10 hours holding time
  • Water baffle: Optically dense, chevron baffle
  • High vacuum valve: 11-3/4" I.D., seals vertically
  • Foreline/Roughing valves: 3" I.D.
  • Valve actuation: Electro-pneumatic (all vacuum valves)
  • Valve sequencing: Manual and automatic (Auto-Tech II)
  • Ionization gauge control: Dual ionization gauge tube, auto ranging with dual convectron positions
  • Dimensions: 79"H x 43"W x 37"D
  • Weight: 1,500 pounds
  • Utilities:
    • Electrical: 208/30/70A/5-wire connection with ground
    • Water: 10 GPM (minimum)
    • Air: 90-110 PSIG

  • Options:
    • Diffusion pump: 5300 liter/second, 10" normal
    • Process chamber: 25.5" diameter x 30" H, ambient or water-cooled (32" bell jar available)
    • Fixturing: Variety of fixturing options: planetary, clamshell, or custom
    • Baseplate: 26" diameter, 11-3/4" pumping port (32" baseplate available)
    • Substrate heat: 2-10 kW
    • Sources: Any commercially available source, including single and multiple beam, CHA's resistance and sputtering sources
    • Hoists: Motorized hoist assembly, 1/2HP motor
    • LN2 Level Control: Automatically maintains liquid level in cryogenic trap
    • Sieve trap: Molecular sieve trap prevents migration or backstreaming of mechanical pump oil into the system
    • RGA port: 2.75 O.D. flange located in base plate of system provides integration of a residual gas analyzer
    • Automatic deposition control: Process controller provides fully automatic deposition sequence
    • Automatic gun rotation control: Positions the crucibles of a turret-type electron beam source
    • Shutter/shutter control: Different design shutters can be incorporated depending on source configuration and number.

For more details, download the Click to download this information in PDF format. CHA Bell Jar Systems Brochure PDF (2.4MB).